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Hexagonal Boron Nitride: The Thinnest Insulating Barrier to Microbial Corrosion
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2018 (English)In: ACS Nano, ISSN 1936-0851, E-ISSN 1936-086X, Vol. 12, no 3, p. 2242-2252Article in journal (Refereed) Published
Abstract [en]

We report the use of a single layer of two-dimensional hexagonal boron nitride (SL-hBN) as the thinnest insulating barrier to microbial corrosion induced by the sulfate-reducing bacteria Desulfovibrio alaskensis G20. We used electrochemical methods to assess the corrosion resistance of SL-hBN on copper against the effects of both the planktonic and sessile forms of the sulfate-reducing bacteria. Cyclic voltammetry results show that SL-hBN-Cu is effective in suppressing corrosion effects of the planktonic cells at potentials as high as 0.2 V (vs Ag/AgCl). The peak anodic current for the SL-hBN coatings is ∼36 times lower than that of bare Cu. Linear polarization resistance tests confirm that the SL-hBN coatings serve as a barrier against corrosive effects of the G20 biofilm when compared to bare Cu. The SL-hBN serves as an impermeable barrier to aggressive metabolites and offers ∼91% corrosion inhibition efficiency, which is comparable to much thicker commercial coatings such as polyaniline. In addition to impermeability, the insulating nature of SL-hBN suppresses galvanic effects and improves its ability to combat microbial corrosion.

Place, publisher, year, edition, pages
American Chemical Society (ACS), 2018. Vol. 12, no 3, p. 2242-2252
Keywords [en]
2D coatings, hexagonal boron nitride, microbial corrosion, sulfate-reducing bacteria
National Category
Materials Chemistry
Identifiers
URN: urn:nbn:se:umu:diva-146804DOI: 10.1021/acsnano.7b06211ISI: 000428972600017PubMedID: 29432687OAI: oai:DiVA.org:umu-146804DiVA, id: diva2:1201860
Available from: 2018-04-26 Created: 2018-04-26 Last updated: 2018-06-09Bibliographically approved

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Upadhyayula, Venkata K. K.

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