Thermal conductivity of copper under high pressure
1977 (English)In: High Temperatures-High Pressures, ISSN 0018-1544, Vol. 9, no 1, 41-48 p.Article in journal (Refereed) Published
The thermal diffusivity, a, of copper has been measured at room temperature up to a pressure of 2.5 GPa (25 kbar) by means of a method recently developed. In this pressure range the diffusivity increases linearly with a slope of (1/a)da/dp = 2.7x10-2 GPa-1. As the density and specific heat of copper are known as functions of pressure, this result can be used to obtain the pressure dependence of the thermal conductivity, lambda, with the result (1/lambda)d(lambda)/dp = 3.1x10-2 GPa-1. This value is shown to agree well with theoretical calculations of this slope. However, a comparison between this result and the pressure dependence of the electrical conductivity shows deviations from the Wiedemann-Franz law.
Place, publisher, year, edition, pages
London: Pion Ltd , 1977. Vol. 9, no 1, 41-48 p.
Thermal diffusivity, thermal conductivity, Ångström's method, high pressure, Cu, copper
Condensed Matter Physics
Research subject Physics
IdentifiersURN: urn:nbn:se:umu:diva-22456OAI: oai:DiVA.org:umu-22456DiVA: diva2:216701